Description

The GE Microprocessor Expander Board DS3800HXPD1C1E is designed for quick installation in the drive. The board features a modular connector on 1 end and retention levers on the other end. The GE Microprocessor Expander Board DS3800HXPD1C1E also is populated with 2 34-pin connectors between the retention levers. The board is also populated with 8 sockets for electrically erasable programmable read-only memory (EEPROM) modules and 18 jumpers.

The GE Microprocessor Expander Board DS3800HXPD1C1E enables the use of multiple microprocessors in the drive. The board provides the EEPROM modules that control and instruct the microprocessors. The microprocessors generate heat and the drive must provide cooling so that heat does not build up in the drive. If heat builds up, an overheat condition can occur. If the temperature of the drive reaches above a predetermined level, the drive will automatically shut down. This protects the drive from damage caused by excessive heat. Excessive heat can cause the components to fail or experience a shortened useful working life. If left unattended, heat build up can result in fire or injury.

The overheat condition is referred to as a trip condition. Other trip conditions exist to prevent damage and injury to the operators and technicians in the area around the drive. Overvoltage is another trip condition. If too much voltage is received by the drive due to a fault in the electrical supply, the drive will shut down.